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1 Bottle BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm leaded Solder Ball For BGA Rework Repair Tool
Specifications:
- Sn content: 63%
- Model Number: solder tin
- Material: Tin
- Lead (Pb): 37%
- Diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
- Application: Mobile Phone Repair
- Application: Circuit boards welding
- Free shipping
We offer free shipping for all products
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- 5 million products
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